Physical Vapor Deposition (Sputtering)


Robusta® is a fully automated, muti-chambered production system. Robusta® is equipped with Physical Vapor Deposition chambers, Degas chambers and Pre-Sputter Clean chambers for complete production of PVD sputtering. Robusta® can sputter various metals on to different substrate, for example, Gold/Titanium-tungsten, Titanium/Copper, Aluminum-Copper and many other metals. The substrates can be Silicon, Glass, Oxide, Polyimide, Molding compounds, silicon on glass etc.

Also Robusta® has already received positive reviews from customers in 40nm Bumping. Furthermore, Robusta® uses ultra high vacuum chambers to insure the purity, satiability and high quality of the sputtering. Robusta® is the affordable solution for advance wafer level packaging.

Robusta®300 (PVD x3, Degas x1, Pre-sputter clean x1)

Robusta® is equipped with
  1. Atmosphere wafer handling system for 12” FOUP. And it is also configurable to 8” wafer production needs.
  2. Mainframe contains 2 loadlock chambers and 6 process chamber slots for maximum production needs.
  3. PVD chambers work for RDL (blanket deposition) and TSV (via holes) liner/barrier layer metallization.
  4. Pre-Clean chamber uses RIE mode soft plasma clean. It helps to reduce out-gas generated from substrate and increase removing of out-gas effectively.
  5. Degas chamber removes out-gas with high vacuum and high temperature system.

Robusta®300 Footprint

Robusta®200S/300 GriFfin

GriFfin is a system that has PVD Liner/Barrier capabilities which commonly used in TSV or MEMS metal sputtering.

GriFfin Chamber