Historical Milestone
年度 大事紀要
2005 CSS kicked off the development of IC Wafer Level Packaging production equipment and system

2006 Robusta®200 formally joined Gold Bump production, high-end Chip Scale Wafer Level Packaging, in ChipMOS TECHNOLOGIES INC. Taiwan

CSS shipped two systems to ChipMOS TECHNOLOGIES (Shanghai) LTD. in China for high-end Chip Scale Wafer Level Packaging
2007 Leading Precision Inc. released Robusta®300 and passed SEMI S2 compliance

Leading Precision Inc. was established

Leading Precision Inc. (LPI) built headquarter facility in Jhu-Nan Township, Miao-Li County, Taiwan

LPI’s project of 300mm Physical Vapor Deposition for Under Bump Metal received Funding from Industrial Development Bureau, Ministry of Economic Affairs for Development of Leading Product Project

2008 Robusta®300, LPI12168, moved in TSMC for Demostration of production

Customized 300mm system, shipped to TSMC and worked with Explore R&D for 20nm Automic Layer Deposition Hi-K and metal gate, Co-Sputter, and Post Dep. Anneal process development

LPI introduced the ERP system for increasing operation efficiency

LPI kicked off the development of Caprica 200 Deep Silicon Etch system

2009 Caprica 300 Deep Silicon Etch system received Funding from Industrial Development Bureau, Ministry of Economic Affairs for Development of Leading Product Project

Lewis330 Sapphire Etcher shipped to Touch Micro-System Tech. for Microelectromechanical Systems production development

Robusta®300 GriFfin System received Funding from Ministry of Science and Technology

2010 Customized Robusta®200 shipped to TSMC Solid State Lighting for LED production

LPI12171 shipped to ADL Engineering Inc. for production, first tool with in-situ interchangable capability between 200mm and 300mm

ChipMOS bought its first 300mm wafer level production tool for 300mm wafer Gold Bump production Caprica 300 Deep Silicon Etch released

2012 Caprica started to perform Caparica Deep Silicon Etch and Oxide Etch process development and production qualification in Advanced Semiconductor Engineering Group

Robusta®200 shipped to Union Semiconductor Co. Ltd. China for Wafer Level Gold Bump Packaging production

LPI12168 kicked off process development for Wafer Level Bumping on Polyimide (PI) substrate, a major material in current Bumping industry

Customized LPI12176 shipped to Semicat, Inc. in Korea for process development of advanced memory devices

Customized LPI08181 shipped to MPI Corporation, Chu-Pei City, Taiwan, and developed non-wafer type substrates sputtering capability

ChipMOS bought the 10th Robusta for Gold Bump and Solder bump production

TSMC Solid State Lighting bought 2nd Robusta for LED production

2013 LPI12168 developed and tested metallization process specifications for high outgas substrate with TSMC supports at Fab 7

LPI12168 passed Bumping metalization process on Polyimide and production qualification at F7 Bump Line, TSMC
2014 LPI12168 joined Integrated-Fan-Out process development and production qualification at TSMC

TSMC bought the 3rd Robusta for Bump Line Fab. in Tainan

ChipMOS bought the 14th Robusta for Gold Bump and Solder bump production

2015 LPI introduced ISO 9001:2008 Quality management systems

LPI12183 shipped to Long-Tan Fab. TSMC for production of InFO qualification

2016 LPI12168 passed process and particle qualification on high outgas substrates of Polyimide, Molding Compound, PR, and Glass/Si Composited wafer

Both LPI12182 and LPI12168 joined formal production in TSMC

LPI12168 passed qualification and became the primary PTOR for 7nm generation IC packaging

ChipMOS bought the 16th Robusta for Gold Bump and Solder bump production
2017 LPI08190 shipped to Semiconductor Manufacturing International Corporation China for TSV process development and production

TSMC bought the 5th Robusta, LPI12188, for new process production in Bump Line Fab. in Tainan

Robusta®300 became a primary production tool of 7nm generation IC packaging

ChipMOS bought GriFfin chambers for Si-Trench TiW / Au production

Union Semiconductor Co. Ltd. China bought the 3rd Robusta for Wafer Level Gold Bump Packaging production